亚洲AV日韩AV天堂无码男人网
?
致誠科技,是一家專業研發生產各種真空設備應用的創新企業!
  • 咨詢熱線:400-0808-236(鄧工)
PVD技術磁控濺射技術電子束蒸發DLCHIPIMSPACVDCVD

濺射是物理氣相沉積技術的另一種方式。
什么是濺射技術?

濺射是物理氣相沉積技術的另一種方式,濺射的過程是由離子轟擊靶材表面,使靶材材料被轟擊出來的技術。惰性氣體,如氬氣,被充入真空腔內,通過使用高電壓,產生輝光放電,加速離子到靶材表面,氬離子將靶材材料從表面轟擊(濺射)出來,在靶材前的工件上沉積下來,通常還需要用到其它氣體,如氮氣和乙炔,和被濺射出來的靶材材料發生反應,形成化合物薄膜。濺射技術可以制備多種涂層,在裝飾涂層上具有很多優點(如Ti、Cr、Zr和碳氮化物),因為其制備的涂層非常光滑,這個優點使濺射技術也廣泛應用于汽車市場的摩擦學領域(例如,CrN、Cr2N及多種類金剛石(DLC)涂層)。高能量離子轟擊靶材,提取原子并將它們轉化為氣態,利用磁控濺射技術,可以對大量材料進行濺射。


Sputtering is another way of physical vapor deposition.

What is sputtering technology?

Sputtering is another way of physical vapor deposition technology. The process of sputtering is to bombard the surface of the target material by ions. Inert gas, such as argon, is charged into the vacuum chamber. By using high voltage, glow discharge is generated to accelerate the ions to the target surface. Argon ions bombard (sputter) the target material from the surface and deposit it on the workpiece in front of the target. Other gases, such as nitrogen and acetylene, are usually used to react with the sputtered target material, Compound films are formed. Sputtering technology can prepare a variety of coatings, and has many advantages in decorative coatings (such as Ti, Cr, Zr and carbonitride). Because the coatings prepared by sputtering technology are very smooth, this advantage makes sputtering technology also widely used in the automotive market in the field of Tribology (such as CrN, Cr2N and various kinds of diamond (DLC) coatings). High energy ions bombard the target, extract the atoms and transform them into gas. Magnetron sputtering technology can be used to sputter a large number of materials.

濺射技術的優點:
+ 靶材采用水冷,減少熱輻射
+ 不需要分解的情況下,幾乎任何金屬材料都可以作為靶材濺射
+ 絕緣材料也可以通過使用射頻或中頻電源濺射
+ 制備氧化物成為可能(反應濺射)
+ 良好的涂層均勻性
+ 涂層非常光滑(沒有液滴)
+ 陰極(最大2m長)可以放置在任何位置,提高了設備設計的靈活性

Advantages of sputtering technology:

+The target is water-cooled to reduce thermal radiation

+Almost any metal material can be sputtered as a target without decomposition

+The insulating material can also be sputtered by using RF or intermediate frequency power supply

+Preparation of oxide possible (reactive sputtering)

+Good coating uniformity

+Very smooth coating (no droplets)

+The cathode (up to 2m long) can be placed in any position, which improves the flexibility of equipment design


濺射技術的缺點:
- 與電弧技術比較,較低的沉積速率
- 與電弧相比,等離子體密度較低(~5%),涂層結合力和涂層致密度較低

The disadvantages of sputtering technology are as follows

-Compared with arc technology, the deposition rate is lower

-Compared with the arc, the plasma density is lower (~ 5%), and the adhesion and density of the coating are lower


濺射技術有多種形式,這里我們將解釋其中的一些,這些濺射技術都能在致誠真空科技生產的真空鍍膜設備上實現。
+ 磁控濺射 使用磁場保持靶材前面等離子體,強化離子的轟擊,提高等離子體密度。
+ UBM 濺射是非平衡磁控濺射的縮寫。使用增強的磁場線圈加強工件附近的等離子密度??梢缘玫礁又旅艿耐繉?。在UBM過程中使用了更高的能量,所以溫度也會相應升高。
+ 閉合場濺射 運用磁場分布限制等離子體于閉合場內。降低靶材材料對真空腔室的損失并使等離子體更加靠近工件??梢缘玫街旅芡繉?,并且使真空腔室保持相對清潔。
+ 孿生靶濺射(DMS)是用來沉積絕緣體涂層的技術。交流電(AC)作用在兩個陰極上,而不是在陰極和真空腔室之間采用直流(DC)。這樣使靶材具有自我清理功能。孿生靶磁控濺射用來高速沉積如氧化物涂層。
+ HIPIMS+ (高功率脈沖磁控濺射)采用高脈沖電源提高濺射材料的離化率。運用HIPIMS+ 制備的涂層兼具了電弧技術和濺射技術的優點。HIPIMS+ 形成致密涂層,具有良好涂層結合力,同時也是原子級的光滑和無缺陷的涂層。

There are many forms of sputtering technology. Here we will explain some of them. These sputtering technologies can be realized on the vacuum coating equipment produced by Zhicheng vacuum technology.

+Magnetron sputtering uses magnetic field to keep plasma in front of target, strengthen ion bombardment and improve plasma density.

+UBM sputtering is the abbreviation of unbalanced magnetron sputtering. An enhanced magnetic field coil is used to enhance the plasma density near the workpiece. A more compact coating can be obtained. Higher energy is used in the UBM process, so the temperature will rise accordingly.

+Closed field sputtering uses the distribution of magnetic field to confine the plasma in the closed field. It can reduce the loss of the target material to the vacuum chamber and make the plasma closer to the workpiece. A dense coating can be obtained and the vacuum chamber can be kept relatively clean.

+Twin target sputtering (DMS) is a technique for depositing insulator coatings. Alternating current (AC) acts on two cathodes instead of direct current (DC) between the cathode and the vacuum chamber. In this way, the target has the function of self-cleaning. Twin target magnetron sputtering is used for high-speed deposition of oxide coatings.

+Hipims + (high power pulsed magnetron sputtering) uses high pulse power supply to improve the ionization rate of sputtered materials. The coating prepared by hipims + has the advantages of both arc technology and sputtering technology. Hipims + forms a dense coating with good adhesion, and is also an atomic smooth and defect free coating.

真空鍍膜設備  真空鍍膜機  真空電鍍設備  蒸發鍍膜機  離子鍍膜機  多弧離子鍍膜機  中頻離子鍍膜機  磁控濺射鍍膜機  硬質鍍膜機  鋁鏡鍍膜機
金屬鍍膜機  金屬鍍膜設備  金屬電鍍設備  金屬真空鍍膜設備  金屬真空鍍膜機  金屬PVD電鍍設備  金屬PVD鍍膜設備  金屬PVD設備  AF真空鍍膜機
玻璃鍍膜機  玻璃鍍膜設備  玻璃電鍍設備  玻璃真空鍍膜設備  玻璃真空鍍膜機  玻璃PVD電鍍設備  玻璃PVD鍍膜設備  玻璃PVD設備  AF真空鍍膜設備
陶瓷鍍膜機  陶瓷鍍膜設備  陶瓷電鍍設備  陶瓷真空鍍膜設備  陶瓷真空鍍膜機  陶瓷PVD電鍍設備  陶瓷PVD鍍膜設備  陶瓷PVD設備  防指紋鍍膜機
塑膠鍍膜機  塑膠鍍膜設備  塑膠電鍍設備  塑膠真空鍍膜設備  塑膠真空鍍膜機  塑膠PVD電鍍設備  塑膠PVD鍍膜設備  塑膠PVD設備  防指紋鍍膜設備
卷材鍍膜機  卷材鍍膜設備  卷材電鍍設備  卷材真空鍍膜設備  卷材真空鍍膜機  卷材PVD電鍍設備  卷材PVD鍍膜設備  卷材PVD設備  防指紋電鍍設備
薄膜鍍膜機  薄膜鍍膜設備  薄膜電鍍設備  薄膜真空鍍膜設備  薄膜真空鍍膜機  薄膜PVD電鍍設備  薄膜PVD鍍膜設備  薄膜PVD設備  AF電鍍設備
五金鍍膜機  五金鍍膜設備  五金電鍍設備  五金真空鍍膜設備  五金真空鍍膜機  五金PVD電鍍設備  五金PVD鍍膜設備  五金PVD設備  環保電鍍設備
不銹鋼鍍膜機  不銹鋼鍍膜設備  不銹鋼電鍍設備  不銹鋼真空鍍膜設備  不銹鋼真空鍍膜機  不銹鋼PVD電鍍設備  不銹鋼PVD鍍膜設備  不銹鋼PVD設備
PVD真空鍍膜機  PVD真空鍍膜設備  PVD真空電鍍設備  PVD涂層設備  PVD電鍍設備  PVD鍍膜設備  PVD鍍膜線  PVD生產線  PVD鍍膜生產線
真空鍍膜線  真空鍍膜自動線  磁控濺射鍍膜線  離子鍍膜線  多弧離子鍍膜線  鍍銀生產線  玻璃鍍膜生產線  磁控濺射鍍膜生產線  板材PVD鍍膜生產線

?

東莞市致誠科技有限公司

地址:廣東省東莞市萬江區大汾流涌尾工業區

熱線:400-0808-236 / 13713375955(鄧工)

QQ: 1296589278

郵箱:1296589278@qq.com /  dgzhicheng@gmail.com

備案號:粵ICP備20043090號

關注公眾號

關注公眾號

鄧工微信

鄧工微信(掃一掃添加)